EYEspex 300

EYEline ^® Optical / Visual inspection

• EYEline 200
• EYEspex 300
• OEM equipment

Inspection criteria for BGA and PCB
Line width and line space on all surface, shorts, opens, nicks plating defects, pad surface contamination, polder mask alignment, scratches and annular ring violation.

Inspection criteria for Lead Frame
Lead positions, lead spacing and width, bridges and pits, mouse bites, lead tip bridging, lead & pad surface, discoloration, staining, contamination, tape location, plating, spot location, downset, coplanarity of leads and silver bleedout.

• Inspection through solder mask
• 100% inspected and sorted HDI or high lead count products.
• Accurate, fast and reliable measurement
• The true final inspection system
• Simultaneous top and bottom inspection
• Automatic statistical reporting for defect tracing in production
• Easy graphical input for teach mode and report
• Easy change for one type of strip to another