EYEline 200

EYEline ^® Optical / Visual inspection

• EYEline 200
• EYEspex 300
• OEM equipment

GENERAL
The EYEline 200, designed to meet high level standards required by semi-conductor companies, is a stand-alone optical inspection system for etched lead frame microBGA or flexible circuit material. Its purpose is the optical control of etched lead frame microBGA or flexible circuit material directly after the etching process, before plating, downset and tape operations. At this stage, the typical etching defects are best visible. Those are: metal to metal spacing, bridging, pitholes.

The system serves a dual purpose: First, this is the direct process feedback about the quality of the etching line. You get the feedback minutes after the reel of material is finished from etching.

Second, this is the best possible way to both detect and remove the defect units from the reel. At this stage, the material has best visibility for defects (before they get plated). Also, the defect units get punched out, so the etching division of your production facility can provide reels with qualified good parts only.

Etching defects occur on a truly random basis. Therefore, they are unavoidable, and the material must be 100% inspected anyway. So you better do this in the responsibility area of the etching operation, rather than ignoring all the defects in all the production steps, until they arrive at final outgoing optical test.

The EYEline 200 system is a stand-alone unit, including the reel based material indexer, puncher unit(s), and camera stage.

• Inspection through solder mask
• 100% inspected and sorted HDI or high lead count products.
• Accurate, fast and reliable measurement
• The true final inspection system
• Simultaneous top and bottom inspection
• Automatic statistical reporting for defect tracing in production
• Easy graphical input for teach mode and report
• Easy change for one type of strip to another